Removing a microprocessor and heat sink

Use this information to remove a microprocessor and heat sink.

The following notes describe the type of microprocessor that the server supports and other information that you must consider when you install a microprocessor and heat sink:

The server supports one Intel land grid array (LGA) 1150 dual-core or quad-core microprocessor. The type, speed, and L3 cache of the microprocessor depends on the server model.
Read the documentation that comes with the microprocessor to determine whether you have to update the server firmware. To download the most current level of server firmware, go to the Lenovo Support Portal and the Fix Central website.
The microprocessor uses an integrated voltage regulator on the system board.

Attention:

Microprocessors are to be installed only by trained technicians.
Important: Always use the microprocessor installation tool to install a microprocessor. Failing to use the microprocessor installation tool may damage the microprocessor sockets on the system board. Any damage to the microprocessor sockets may require replacing the system board.
Do not allow the thermal grease on the microprocessor and heat sink to come in contact with anything. Contact with any surface can compromise the thermal grease and the microprocessor socket.
Dropping the microprocessor during installation or removal can damage the contacts.
Do not touch the microprocessor contacts; handle the microprocessor by the edges only. Contaminants on the microprocessor contacts, such as oil from your skin, can cause connection failures between the contacts and the socket.
The pins on the sockets are fragile. Any damage to the pins might require replacing the system board.

Read the safety information in Safety and Installation guidelines.

If you are replacing a server component in the server, you need to turn off the server and peripheral devices, and disconnect the power cords and all external cables.

To remove a microprocessor and heat sink, complete the following steps.

Remove the cover (see Removing the cover).
Remove the air baffle if installed (see Removing the air baffle).
Remove the heat sink:
CAUTION:
The heat sink may become very hot during normal operation. Allow time for the heat sink to cool down before you touch it.
1. Loosen the screws and alternate among the screws until they break the seal with the microprocessor.
2. Press firmly on the captive screws and loosen them with a screwdriver.
3. Use your fingers to gently pull the heat sink from the microprocessor.
Lift the heat sink out of the server. After removal, place the heat sink on its side on a clean, flat surface.
Attention: Do not touch the thermal material on the bottom of the heat sink. Touching the thermal material will contaminate it. If the thermal material on the microprocessor or heat sink becomes contaminated, you must wipe off the contaminated thermal material on the microprocessor or heat sink with the alcohol wipes and reapply clean thermal grease to the heat sink.
Release the microprocessor retention latch by pressing down on the end, moving it to the side, and releasing it to the open (up) position.
Open the microprocessor bracket frame by lifting up the tab on the top edge. Keep the bracket frame in the open position.
Attention: Handle the microprocessor carefully. Dropping the microprocessor during removal can damage the contacts. Also, contaminants on the microprocessor contacts, such as oil from your skin, can cause connection failures between the contacts and the socket.
Remove the microprocessor:
1. Carefully lift the microprocessor straight up and out of the socket, without touching the microprocessor contacts.
2. Place the microprocessor on a static-protective surface.
Attention: The pins on the sockets are fragile. Any damage to the pins might require replacing the system board.

If you are instructed to return the server component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.